HDI Design Workflow: From Decisions to Fabrication

Proper HDI design is critical for meeting the demands of today’s compact, high-performance electronics.
From managing layer stackups to routing fine-pitch BGAs, every decision impacts your design’s manufacturability and reliability.

Join us for a live webinar with Kirsch Mackey, where he will cover the following:

• How to architect effective layer stackups for HDI designs.
• Techniques for fine-pitch BGA breakout routing.
• In-tool DFM validation to ensure fabrication success.

Kirsch will demonstrate these techniques using a NVIDIA Jetson-based carrier board, giving you practical insights to apply directly to your projects.

Unable to attend live? Register anyway and we will send you the recording so you can watch it at your convenience. Clicking the link will redirect you to Cadence’s registration page