The new Virtuoso platform addresses the advanced design environment challenges faced by today’s design engineers. Smart products are becoming very highly integrated with multiple components all on the same substrate or advanced package. These products utilize RF, 5G, photonics, heterogeneous integration, advanced node SoC, and mixed-signal SoCs. This drives the need to tie all of these into a single, integrated platform across chip-package-and board. The new breakthrough Virtuoso platform combines our award-winning system design platform with our packaging, board, and system analysis expertise providing a comprehensive solution for system design and analysis for the most complex design needs.